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this document is a general product description and is subject to change without notice. hynix semiconductor does not assume any responsibility for use of circuits described. no pat ent licenses are implied. rev. 0.3 / mar. 2009 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 512mb ddr2 sdram h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l)
rev. 0.3 /mar. 2009 2 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) revision history rev. history draft date 0.1 initial version june 2008 0.2 editorial change on t oper november 2008 0.3 h5ps5182ffp-xxl : changed idd6 value march 2009
rev. 0.3 /mar. 2009 3 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) contents 1. description 1.1 device features and ordering information 1.1.1 key features 1.1.2 ordering information 1.1.3 ordering frequency 1.2 pin configuration 1.3 pin description 2. maximum dc ratings 2.1 absolute maximum dc ratings 2.2 operating temperature condition 3. ac & dc operating conditions 3.1 dc operating conditions 5.1.1 recommended dc operating conditions(sstl_1.8) 5.1.2 odt dc electrical characteristics 3.2 dc & ac logic input levels 3.2.1 input dc logic level 3.2.2 input ac logic level 3.2.3 ac input test conditions 3.2.4 differential input ac logic level 3.2.5 differential ac output parameters 3.3 output buffer levels 3.3.1 output ac test conditions 3.3.2 output dc current drive 3.3.3 ocd default characteristics 3.4 idd specifications & measurement conditions 3.5 input/output capacitance 4. ac timing specifications 5. package dimensions
rev. 0.3 /mar. 2009 4 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 1. description 1.1 device features & ordering information 1.1.1 key features ? vdd,vddq =1.8 +/- 0.1v ? all inputs and outputs are comp atible with sstl_18 interface ? fully differential clock in puts (ck, /ck) operation ? double data rate interface ? source synchronous-data transaction aligne d to bidirectional data strobe (dqs, dqs ) ? differential data strobe (dqs, dqs ) ? data outputs on dqs, dqs edges when read (edged dq) ? data inputs on dqs centers when write (centered dq) ? on chip dll align dq, dqs and dqs transition with ck transition ? dm mask write data-in at the both risi ng and falling edges of the data strobe ? all addresses and control inputs except data, data stro bes and data masks latched on the rising edges of the clock ? programmable cas latency 3, 4, 5 and 6 supported ? programmable additive latency 0, 1, 2, 3, 4 and 5 supported ? programmable burst length 4 / 8 with bo th nibble sequential and interleave mode ? internal four bank operations with single pulsed ras ? auto refresh and self refresh supported ? tras lockout supported ? 8k refresh cycles /64ms ? jedec standard 60ball fbga(x4/x8). ? full strength driver option controlled by emrs ? on die termination supported ? off chip driver impedance adjustment supported ? read data strobe supported (x8 only) ? self-refresh high temperature entry ? partial array self refresh support ordering information part no. organization package h5ps5142ffp-xx* 128mx4 lead free** h5ps5182ffp-xx* 64mx8 note: 1. -x* is the speed bin, refer to the operation frequency table for complete part no. 2. hynix lead-free products are compliant to rohs. 3. h5ps51(4/8)2ffp-xxc is comme rtial temp. and normal power 4. h5ps51(4/8)2ffp-xxl is co mmertial temp. and low power operating frequency speed bin tck (ns) cl trcd trp unit e3 5333 clk c4 3.75 4 4 4 clk y5 3555 clk s5 2.5 5 5 5 clk s6 2.5 6 6 6 clk
rev. 0.3 /mar. 2009 5 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 1.2 pin configuratio n & address table 128mx4 ddr2 pin configuration (top view: see balls through package) 3 vss dm vddq dq3 vss we ba1 a1 a5 a9 nc 2 nc vssq dq1 vssq vref cke ba0 a10 a3 a7 a12 1 vdd nc vddq nc vddl nc vss vdd a b c d e f g h j k l 7 vssq dqs vddq dq2 vssdl ras cas a2 a6 a11 nc 8 dqs vssq dq0 vssq ck ck cs a0 a4 a8 a13 9 vddq nc vddq nc vdd odt vdd vss row and column address table items 128mx4 # of bank 4 bank address ba0, ba1 auto precharge flag a10/ap row address a0 - a13 column address a0-a9, a11 page size 1 kb
rev. 0.3 /mar. 2009 6 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 64mx8 ddr2 pin configuration (top view: see balls through package) 3 vss dm, rdqs vddq dq3 vss we ba1 a1 a5 a9 nc 2 nu, rdqs vssq dq1 vssq vref cke ba0 a10 a3 a7 a12 1 vdd dq6 vddq dq4 vddl nc vss vdd a b c d e f g h j k l 7 vssq dqs vddq dq2 vssdl ras cas a2 a6 a11 nc 8 dqs vssq dq0 vssq ck ck cs a0 a4 a8 a13 9 vddq dq7 vddq dq5 vdd odt vdd vss row and column address table items 64mx8 # of bank 4 bank address ba0, ba1 auto precharge flag a10/ap row address a0 - a13 column address a0-a9 page size 1 kb
rev. 0.3 /mar. 2009 7 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 1.3 pin description pin type description ck, ck input clock: ck and ck are differential clock inputs. all a ddress and control input signals are sampled on the crossing of the positive edge of ck and negative edge of ck . output (read) data is referenced to the crossings of ck and ck (both directions of crossing). cke input clock enable: cke high activates, and cke low deactivates internal clock signals, and device input buffers and output drivers. taking cke low provides precharge power down and self refresh operation (all banks idle), or active power down (row active in any bank). cke is synchronous for power down entry and exit, and for self refresh entry. cke is asynchronous for self refresh exit. after v ref has become stable during the power on and initia lization sequence, it must be maintained for proper operation of the cke receiver. for proper self-refresh entry and exit, v ref must be maintained to this input. cke must be maintained high throughout read and write accesses. input buffers, excluding ck, ck and cke are disabled during power down. input buffers, excluding cke are disabled during self refresh. cs input chip select: all commands are masked when cs is registered high. cs provides for external bank selection on sy stems with multiple banks. cs is considered part of the command code. odt input on die termination control: odt (registered high) enables on die termination resis- tance internal to the ddr2 sdram. when enabled, odt is only applied to dq, dqs, dqs , rdqs, rdqs , and dm signal for x4,x8 configurations. for x16 configuration odt is applied to each dq, udqs/udqs .ldqs/ldqs , udm and ldm signal. the odt pin will be ignored if the extended mode regi ster(emrs(1)) is programmed to disable odt. ras , cas , we input command inputs: ras , cas and we (along with cs ) define the command being entered. dm (ldm, udm) input input data mask: dm is an input mask sign al for write data. input data is masked when dm is sampled high coin cident with that input data during a write access. dm is sampled on both edges of dqs, although dm pins are input only, the dm loading matches the dq and dqs loading. for x8 de vice, the function of dm or rdqs/ rdqs is enabled by emrs command. ba0 - ba2 input bank address inputs: ba0 - ba2 define to which bank an active, read, write or pre- charge command is being applied (for 256mb and 512mb, ba2 is not applied). bank address also determines if the mode register or extended mode register is to be accessed during a mrs or emrs cycle. a0 -a15 input address inputs: provide the row address for active commands, and the column address and auto precharge bit for read/write commands to select one location out of the memory array in the respective bank. a10 is sampled during a precharge command to determine whether the precharg e applies to one bank (a10 low) or all banks (a10 high). if only one bank is to be precharged, the bank is selected by ba0- ba2. the address inputs also provide the op code during mode register set com- mands. dq input/ output data input / output: bi -directional data bus
rev. 0.3 /mar. 2009 8 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) pin type description dqs, (dqs) (udqs),(udqs ) (ldqs),(ldqs ) (rdqs),(rdqs ) input/ output data strobe: output with read data, input with write data. edge aligned with read data, centered in write data. for the x16, ldqs correspond to the data on dq0~dq7; udqs corresponds to the data on dq8~dq15. for the x8, an rdqs option using dm pin can be enabled via the emrs(1) to simplify re ad timing. the data strobes dqs, ldqs, udqs, and rdqs may be used in single ende d mode or paired with optional comple- mentary signals dqs, ldqs,udqs and rdqs to provide differential pair signaling to the system during both reads an d writes. an emrs(1) control bit enables or disables all complementary data strobe signals. in this data sheet, "differential dqs signals" refers to any of the following with a10 = 0 of emrs(1) x4 dqs/dqs x8 dqs/dqs if emrs(1)[a11] = 0 x8 dqs/dqs , rdqs/rdqs , if emrs(1)[a11] = 1 x16 ldqs/ldqs and udqs/udqs "single-ended dqs signals" refers to any of the following with a10 = 1 of emrs(1) x4 dqs x8 dqs if emrs(1)[a11] = 0 x8 dqs, rdqs, if emrs(1)[a11] = 1 x16 ldqs and udqs nc no connect: no internal elec trical connection is present. vddq supply dq power supply: 1.8v +/- 0.1v vssq supply dq ground vddl supply dll power supply: 1.8v +/- 0.1v vssdl supply dll ground vdd supply power supply: 1.8v +/- 0.1v vss supply ground vref supply reference voltage fo r inputs for sstl interface. -continue-
rev. 0.3 /mar. 2009 9 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 2. maximum dc ratings 2.1 absolute maxi mum dc ratings 2.2 operating temperature condition symbol parameter rating units notes vdd voltage on vdd pin relative to vss - 1.0 v ~ 2.3 v v 1 vddq voltage on vddq pin relative to vss - 0.5 v ~ 2.3 v v 1 vddl voltage on vddl pin relative to vss - 0.5 v ~ 2.3 v v 1 v in, v out voltage on any pin relative to vss - 0.5 v ~ 2.3 v v 1 t stg storage temperature -55 to +100 ? 1, 2 i i input leakage current; any input 0v vin vdd; all other balls not under test = 0v) -2 ua ~ 2 ua ua i oz output leakage current; 0v vout vddq; dq and odt disabled -5 ua ~ 5 ua ua 1. stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sect ions of this specification is not im plied. exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. storage temperature is the case surface temperature on the center/top side of the dram. for the measurement conditions. please refer to jesd51-2 standard. symbol parameter rating units notes t oper operating temperature 0 to 95 c 1,2 1. operating temperature is the case surface temperature on the center/t op side of the dram. for the mea- surement conditions, please refer to jesd51-2 standard. 2. at t oper 85~95 ? double refresh rate (trefi: 3.9us) is required, and to enter the self refresh mode at this temperature range it mu st be required an emrs command to change itself refresh rate.
rev. 0.3 /mar. 2009 10 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3. ac & dc operating conditions 3.1 dc operating conditions 3.1.1 recommended dc operating conditions (sstl_1.8) 3.1.2 odt dc electrical characteristics symbol parameter rating units notes min. typ. max. vdd supply voltage 1.7 1.8 1.9 v 1 vddl supply voltage for dll 1.7 1.8 1.9 v 1,2 vddq supply voltage for output 1.7 1.8 1.9 v 1,2 vref input reference voltage 0.49*vddq 0.50*vddq 0.51*vddq mv 3,4 vtt termination voltage vref-0.04 vref vref+0.04 v 5 1. min. typ. and max. values increase by 100mv for c3(ddr2-533 3-3-3) speed option. 2. vddq tracks with vdd,vddl trac ks with vdd. ac parameters are measured with vdd,vddq and vdd. 3. the value of vref may be selected by the user to pr ovide optimum noise margin in the system. typically the value of vref is expected to be about 0.5 x vddq of the transmitting device and vref is expected to track vari- ations in vddq 4. peak to peak ac noise on vref may not exceed +/-2% vref (dc). 5. vtt of transmitting device must track vref of receiving device. parameter/condition symbol min nom max units notes rtt effective impedance value for emrs(a 6,a2)=0,1; 75 ohm rtt1(eff) 60 75 90 ohm 1 rtt effective impedance value for emrs(a6, a2)=1,0; 150 ohm rtt2(eff) 120 150 180 ohm 1 rtt effective impedance value for emrs(a 6,a2)=1,1; 50 ohm rtt3(eff) 40 50 60 ohm 1 deviation of vm with respect to vddq/2 delta vm -6 +6 % 1 note: 1. test condition for rtt measurements measurement definition for rtt (eff): apply v ih (ac) and v il (ac) to test pin separately, then measure current i(v ih (ac)) and i(v il (ac)) respectively. v ih (ac), v il (ac), and vddq values defined in sstl_18 measurement definition for vm: measurement voltage at test pin (mid point) with no load. rtt (eff) = v ih (ac) - v il (ac) i( v ih (ac) ) - i( v il (ac) ) delta vm = 2 x vm vddq x 100% - 1
rev. 0.3 /mar. 2009 11 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.2 dc & ac logic input levels 3.2.1 input dc logic level 3.2.2 input ac logic level 3.2.3 ac input test conditions note: 1. input waveform timing is referenced to the input signal crossing through the v ref level applied to the device under test. 2. the input signal minimum slew rate is to be maintained over the range from v ref to v ih(ac) min for rising edges and the range from v ref to v il(ac) max for falling edges as shown in the below figure. 3. ac timings are referenced with input waveforms switch ing from vil(ac) to vih(ac) on the positive transitions and vih(ac) to vil(ac) on the negative transitions. symbol parameter min. max. units notes v ih (dc) dc input logic high vref + 0.125 vddq + 0.3 v v il (dc) dc input logic low - 0.3 vref - 0.125 v symbol parameter ddr2 400,533 ddr2 667,800 units notes min. max. min. max. v ih (ac) ac input logic high vref + 0.250 - vref + 0.200 -v v il (ac) ac input logic low - vref - 0.250 - vref - 0.200 v symbol condition value units notes v ref input reference voltage 0.5 * v ddq v1 v swing(max) input signal maximum peak to peak swing 1.0 v 1 slew input signal minimum slew rate 1.0 v/ns 2, 3 v ddq v ih(ac) min v ref v swing(max) delta tr delta tf v ih(dc) min v il(dc) max v il(ac) max v ss rising slew = delta tr v ih(ac) min - v ref v ref - v il(ac) max delta tf falling slew = < figure: ac input test signal waveform>
rev. 0.3 /mar. 2009 12 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.2.4 differential input ac logic level 3.2.5 differential ac output parameters symbol parameter min. max. units notes v id (ac) ac differential input voltage 0.5 vddq + 0.6 v 1 v ix (ac) ac differential cross point voltage 0.5 * vddq - 0.175 0.5 * vddq + 0.175 v 2 1. vin(dc) specifies the allowable dc execution of each input of differential pair such as ck, ck , dqs, dqs , ldqs, ldqs , udqs and udqs . 2. vid(dc) specifies the input differenti al voltage |vtr -vcp | required for sw itching, where vtr is the true input (such as ck, dqs, ldqs or udqs) level and vcp is the complementary input (such as ck , dqs , ldqs or udqs ) level. the minimum value is equal to vih(dc) - v il(dc). note: 1. vid(ac) specifies the input differentia l voltage |vtr -vcp | required for switching, where vtr is the true input signal (such as ck, dqs, ldqs or udqs) an d vcp is the complementary input signal (such as ck , dqs , ldqs or udqs ). the minimum value is equa l to v ih(ac) - v il(ac). 2. the typical value of vix(ac) is expected to be about 0.5 * vddq of the transmitting device and vix(ac) is expected to track variations in vddq. vix(ac) indi cates the voltage at which diff erential input signals must cross. symbol parameter min. max. units notes v ox (ac) ac differential cross point voltage 0.5 * vddq - 0.125 0.5 * vddq + 0.125 v 1 note: 1. the typical value of vox(ac) is expected to be about 0.5 * v ddq of the transmitting device and vox(ac) is expected to track variations in vddq. vox(ac) in dicates the voltage at which differential output signals must cross. v ddq crossing point v ssq v tr v cp v id v ix or v ox < differential signal levels >
rev. 0.3 /mar. 2009 13 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.3 output buffer characteristics 3.3.1 output ac test conditions 3.3.2 output dc current drive symbol parameter sstl_18 class ii units notes v otr output timing measurement reference level 0.5 * v ddq v1 1. the vddq of the device under test is referenced. symbol parameter sstl_18 units notes i oh(dc) output minimum source dc current - 13.4 ma 1, 3, 4 i ol(dc) output minimum sink dc current 13.4 ma 2, 3, 4 1. v ddq = 1.7 v; v out = 1420 mv. (v out - v ddq )/i oh must be less than 21 ohm for values of v out between v ddq and v ddq - 280 mv. 2. v ddq = 1.7 v; v out = 280 mv. v out /i ol must be less than 21 ohm for values of v out between 0 v and 280 mv. 3. the dc value of v ref applied to the receiving device is set to v tt 4. the values of i oh(dc) and i ol(dc) are based on the conditions given in notes 1 and 2. they are used to test device drive current capability to ensure v ih min plus a noise margin and v il max minus a noise margin are delivered to an sstl_18 receiver. the actual current values are derived by shifting the desired driver operating point (see section 3.3) along a 21 oh m load line to define a convenient driver current for measurement.
rev. 0.3 /mar. 2009 14 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.3.3 ocd default characteristics description parameter min nom max unit notes output impedance see full strength default driver characteristics ohms 1 output impedance step size for ocd calibration 0 1.5 ohms 6 pull-up and pull-down mismatch 0 4 ohms 1,2,3 output slew rate sout 1.5 - 5 v/ns 1,4,5,6,7,8 note 1. absolute specifications ( toper; vdd = +1.8v 0.1 v, vddq = +1.8v 0.1v). dram i/o specifications for timing, voltage, and slew rate are no longer applicable if ocd is changed from default settings. please refer to the device operation & timing diagram of ddr2 for the full strength default driver characteristics. 2. impedance measurement condition for output source dc current: vddq=1.7v; vout=1420mv; (vout-vddq)/ioh must be less than 23.4 ohms for values of vout between vddq and vddq-280mv. impedance measurement condition for output sink dc current: vddq = 1.7v; vout = 280mv; vout/iol must be less than 23.4 ohms for values of vout between 0v and 280mv. 3. mismatch is absolute value between pull-up and pull-d n, both are measured at same temperature and voltage. 4. slew rate measured from vil(ac) to vih(ac). 5. the absolute value of the slew rate as measured from dc to dc is equal to or greater than the slew rate as measured from ac to ac. this is guaranteed by design and characterization. 6. this represents the step size when the ocd is near 18 ohms at nominal conditions across all process corners/ variations and represents only the dram uncertainty. a 0 ohm value(no calibration) can only be achieved if the ocd impedance is 18 ohms +/- 0.75 ohms under nominal conditions. output slew rate load: 7. dram output slew rate specification applies to 400, 533 and 667 mt/s speed bins. 8. timing skew due to dram output slew rate mis-match between dqs / dqs and associated dqs is included in tdqsq and tqhs specification. vtt 25 ohms output (vout) reference point
rev. 0.3 /mar. 2009 15 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.4 idd specifications & test conditions idd specifications(max) note: 1. low power parts have an extra suffix ?l? in part number; h5ps5182ffp-c4 l symbol ddr2 800 ddr2 667 ddr2 533 ddr2 400 units x4/x8 x4/x8 x4/x8 x4/x8 idd0 80 75 75 70 ma idd1 90 85 85 85 ma idd2p 8888ma idd2q 35 35 30 30 ma idd2n 40 40 35 35 ma idd3p f 30 30 30 30 ma s 12 12 12 12 ma idd3n 55 55 50 50 ma idd4w 115 100 75 75 ma idd4r 125 110 85 85 ma idd5 115 110 105 105 ma idd6 normal power 8888ma low power* 2.5 2.5 2.5 2.5 ma idd7 175 165 155 145 ma
rev. 0.3 /mar. 2009 16 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) idd test conditions (idd values are for full operating range of voltage and temperature, notes 1-5) symbol conditions units idd0 operating one bank active-precharge current ; t ck = t ck(idd), t rc = t rc(idd), t ras = t ras min (idd); cke is high, cs is high between valid commands; address bus inputs are switching; data bus inputs are switching ma idd1 operating one bank active-read-precharge current ; iout = 0ma;bl = 4, cl = cl(idd), al = 0; t ck = t ck(idd), t rc = t rc (idd), t ras = t rasmin (idd), t rcd = t rcd(idd); cke is high, cs is high between valid commands; address bus inputs are switching; data pattern is same as idd4w ma idd2p precharge power-down current ; all banks idle; t ck = t ck(idd); cke is low; other control and address bus inputs are stable; data bus inputs are floating ma idd2q precharge quiet standby current ; all banks idle; t ck = t ck(idd);cke is high, cs is high; other control and address bus inputs are stable; data bus inputs are floating ma idd2n precharge standby current ; all banks idle; t ck = t ck(idd); cke is high, cs is high; other control and address bus inputs are switching; data bus inputs are switching ma idd3p active power-down current ; all banks open; t ck = t ck(idd); cke is low; other control and address bus inputs are stable; data bus inputs are floating fast pdn exit mrs(12) = 0 ma slow pdn exit mrs(12) = 1 ma idd3n active standby current ; all banks open; t ck = t ck(idd), t ras = t rasmax (idd), t rp = t rp(idd); cke is high, cs is high between valid commands; other control and address bus inputs are switching; data bus inputs are switching ma idd4w operating burst write current ; all banks open, continuous burst writes; bl = 4, cl = cl(idd), al = 0; t ck = t ck(idd), t ras = t rasmax (idd), t rp = t rp(idd); cke is high, cs is high between valid commands; address bus inputs ar e switching; data bus inputs are switching ma idd4r operating burst read current ; all banks open, continuous burs t reads, iout = 0ma; bl = 4, cl = cl(idd), al = 0; t ck = t ck(idd), t ras = t rasmax (idd), t rp = t rp(idd); cke is high, cs is high between valid commands; address bus inpu ts are switching; data pattern is same as idd4w ma idd5b burst refresh current ; t ck = t ck(idd); refresh command at every t rfc(idd) interval; cke is high, cs is high between valid commands; other co ntrol and address bus inputs are switch- ing; data bus inputs are switching ma idd6 self refresh current ; ck and ck at 0v; cke 0.2v; other control and address bus inputs are floating; data bus inputs are floating ma
rev. 0.3 /mar. 2009 17 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) idd7 operating bank interleave read current ; all bank interleaving reads, iout = 0ma; bl = 4, cl = cl(idd), al = t rcd(idd)-1* t ck(idd); t ck = t ck(idd), t rc = t rc(idd), t rrd = t rrd(idd), t rcd = 1* t ck(idd); cke is high, cs is high between valid comma nds; address bus inputs are stable during deselects; data pattern is same as idd4r; - refer to the following page for detailed timing conditions ma note: 1. vddq = 1.8 +/- 0.1v ; vdd = 1.8 +/- 0.1v (exclusively vddq = 1.9 +/- 0.1v ; vdd = 1.9 +/- 0.1v for c3 speed grade) 2. idd specifications are tested afte r the device is properly initialized 3. input slew rate is specified by ac parametric test condition 4. idd parameters are specified with odt disabled. 5. data bus consists of dq, dm, dqs, dqs, rdqs, rdqs , ldqs, ldqs, udqs, and udqs. idd values must be met with all combinations of emrs bits 10 and 11. 6. definitions for idd low is defined as vin vilac (max) high is defined as vin ? vihac (min) stable is defined as inputs stable at a high or low level floating is defined as inputs at vref = vddq/2 switching is defined as: inputs changing between hi gh and low every other clock cycle (once per two clocks) for address and control signals, and inputs changing between high and low every other data transfer (once per clock) for dq signals no t including masks or strobes.
rev. 0.3 /mar. 2009 18 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) for purposes of idd testing, the follo wing parameters are to be utilized detailed idd7 the detailed timings are shown below for idd7. changes will be required if timi ng parameter changes are made to the specification. legend: a = active; ra = read with autoprecharge; d = deselect idd7: operating current: all bank interleave read operation all banks are being interleaved at minimum t rc(idd) without violating t rrd(idd) using a burst length of 4. control and address bus inputs are stable during deselects. iout = 0ma timing patterns for 4 bank devices x4/ x8/ x16 -ddr2-400 3/3/3: a0 ra0 a1 ra1 a2 ra2 a3 ra3 d d d (11 clocks) -ddr2-533 3/3/3: a0 ra0 d a1 ra1 d a2 ra2 d a3 ra3 d d d d (15 clocks) -ddr2-533 4/4/4: a0 ra0 d a1 ra1 d a2 ra2 d a3 ra3 d d d d d (16 clocks) -ddr2-667 4/4/4: a0 ra0 d d a1 ra1 d d a2 ra2 d d a3 ra3 d d d d d (19 clocks) -ddr2-667 5/5/5: a0 ra0 d d a1 ra1 d d a2 ra2 d d a3 ra3 d d d d d d (20 clocks) -ddr2-800 5/5/5: a0 ra0 d d a1 ra1 d d a2 ra2 d d a3 ra3 d d d d d d d d d (23 clocks) -ddr2-800 6/6/6: a0 ra0 d d a1 ra1 d d a2 ra2 d d a3 ra3 d d d d d d d d d d (24 clocks) speed bin (cl-trcd-trp) ddr2-800 ddr2-667 ddr2-533 ddr2-400 units 5-5-5 6-6-6 5-5-5 4-4-4 3-3-3 cl(idd) 5 6 5 4 3 tck t rcd(idd) 12.5 15 15 15 15 ns t rc(idd) 57.25 60 60 60 55 ns t rrd(idd)-x4/x8 7.5 7.5 7.5 7.5 7.5 ns t rrd(idd)-x16 10 10 10 10 10 ns t ck(idd) 2.5 2.5 3 3.75 5 ns t rasmin (idd) 45 45 45 45 40 ns t rasmax (idd) 70000 70000 70000 70000 70000 ns t rp(idd) 12.5 15 15 15 15 ns t rfc(idd)-256mb 75 75 75 75 75 ns t rfc(idd)-512mb 105 105 105 105 105 ns t rfc(idd)-1gb 127.5 127.5 127.5 127.5 127.5 ns
rev. 0.3 /mar. 2009 19 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 3.5. input/output capacitance 4. electrical characteristics & ac timing specification (0 ?? t case ?? v ddq = 1.8 v +/- 0.1v; v dd = 1.8v +/- 0.1v) refresh parameters by device density ddr2 sdram speed bins and trcd, trp and trc for corresponding bin parameter symbol ddr2- 400 ddr2- 533 ddr2 667 ddr2 800 units min max min max min max input capacitance, ck and ck cck 1.0 2.0 1.0 2.0 1.0 2.0 pf input capacitance delta, ck and ck cdck x 0.25 x 0.25 x 0.25 pf input capacitance, all other input-only pins ci 1.0 2.0 1.0 2.0 1.0 1.75 pf input capacitance delta, all other input-only pins cdi x 0.25 x 0.25 x 0.25 pf input/output capacitance, dq, dm, dqs, dqs cio 2.5 4.0 2.5 3.5 2.5 3.5 pf input/output capacitance delta, dq, dm, dqs, dqs cdio x 0.5 x 0.5 x 0.5 pf parameter symbol 256mb 512mb 1gb 2gb 4gb units refresh to active /refresh command time trfc 75 105 127.5 195 327.5 ns average periodic refresh interval trefi 0 ?? t case ? 8 ? 7.8 7.8 7.8 7.8 7.8 us 85 ? < t case ?? 3.9 3.9 3.9 3.9 3.9 us speed ddr2-800d ddr2-800e ddr2-667d ddr2-533c ddr2-400b units bin (cl-trcd-trp) 5-5-5 6-6-6 5-5-5 4-4-4 3-3-3 parameter min min min min min cas latency 56545tck trcd 12.5 15 15 15 15 ns trp 12.5 15 15 15 15 ns tras 45 45 45 45 40 ns trc 57.2560606055ns
rev. 0.3 /mar. 2009 20 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) timing parameters by speed grade (refer to notes for information related to this table at the following pages of this table) parameter symbol ddr2-400 ddr2-533 unit note min max min max dq output access time from ck/ck tac -600 +600 -500 +500 ps dqs output access time from ck/ck tdqsck -500 +500 -450 +450 ps ck high-level width tch 0.45 0.55 0.45 0.55 tck ck low-level width tcl 0.45 0.55 0.45 0.55 tck ck half period thp min (tcl,tch) - min (tcl,tch) - ps 11,12 clock cycle time, cl=x tck 5000 8000 3750 8000 ps 15 dq and dm input setup time (differential strobe) tds (base) 150 - 100 - ps 6,7,8, 20 dq and dm input hold time (differential strobe) tdh (base) 275 - 225 - ps 6,7,8, 21 dq and dm input setup time (single ended strobe) tds 25 --25 - ps 6,7,8, 20 dq and dm input hold time (single ended strobe) tdh 25 --25 - ps 6,7,8, 21 control & address input pulse width for each input tipw 0.6 -0.6 - tck dq and dm input pulse width for each input tdipw 0.35 -0.35 - tck data-out high-impedance time from ck/ck thz - tac max - tac max ps 18 dqs low-impedance time from ck/ck tlz(dqs) tac min tac max tac min tac max ps 18 dq low-impedance time from ck/ck tlz(dq) 2*tac min tac max 2*tac min tac max ps 18 dqs-dq skew for dqs and associated dq signals tdqsq -350 -300 ps 13 dq hold skew factor tqhs -450 -400 ps 12 dq/dqs output hold time from dqs tqh thp - tqhs - thp - tqhs - ps first dqs latching transition to associated clock edge tdqss -0.25 + 0.25 -0.25 + 0.25 tck dqs input high pulse width tdqsh 0.35 - 0.35 - tck dqs input low pulse width tdqsl 0.35 - 0.35;; - tck dqs falling edge to ck setup time tdss 0.2 - 0.2 - tck dqs falling edge hold time from ck tdsh 0.2 - 0.2 - tck mode register set command cycle time tmrd 2 - 2 - tck write postamble twpst 0.4 0.6 0.4 0.6 tck 10 write preamble twpre 0.35 - 0.35 - tck address and control input setup time tis(base) 350 - 250 - ps 5,7,9, 23 address and control input hold time tih(base) 475 - 375 - ps 5,7,9, 23
rev. 0.3 /mar. 2009 21 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) -continue- (refer to notes for information related to this table at the following pages of this table) parameter symbol ddr2-400 ddr2-533 unit note min max min max read preamble trpre 0.9 1.1 0.9 1.1 tck read postamble trpst 0.4 0.6 0.4 0.6 tck active to active command period for 1kb page size products trrd 7.5 -7.5 - ns 4 active to active command period for 2kb page size products trrd 10 -10 - ns 4 four active window for 1kb page size products tfaw 37.5 -37.5 - ns four active window for 2kb page size products tfaw 50 -50 - ns cas to cas command delay tccd 2 2 tck write recovery time twr 15 -15 - ns auto precharge write recovery + precharge time tdal wr+trp - wr+trp - tck 14 internal write to read command delay twtr 10 -7.5 - ns 24 internal read to precharge command delay trtp 7.5 7.5 ns 3 exit self refresh to a non-read command txsnr trfc + 10 trfc + 10 ns exit self refresh to a read command txsrd 200 - 200 - tck exit precharge power down to any non- read command txp 2 - 2 - tck exit active power down to read command txard 2 2 tck 1 exit active power down to read command (slow exit, lower power) txards 6 - al 6 - al tck 1, 2 cke minimum pulse width (high and low pulse width) t cke 3 3 tck 27 odt turn-on delay t aond 2222tck odt turn-on t aon tac (min) tac(max) +1 tac (min) tac(max) +1 ns 16 odt turn-on (power-down mode) t aonpd tac(min)+ 2 2tck+ tac(max) +1 tac(min)+ 2 2tck+ tac(max) +1 ns odt turn-off delay t aofd 2.52.52.52.5tck odt turn-off t aof tac (min) tac (max)+ 0.6 tac (min) tac (max)+ 0.6 ns 17 odt turn-off (power-down mode) t aofpd tac(min)+ 2 2.5tck+ tac(max) +1 tac(min)+ 2 2.5tck+ tac(max) +1 ns odt to power down en try latency tanpd 3 3 tck odt power down exit latency taxpd 8 8 tck ocd drive mode output delay toit 0 12 0 12 ns minimum time clocks remains on after cke asynchronously drops low tdelay tis + tck + tih tis + tck + tih ns 15
rev. 0.3 /mar. 2009 22 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) parameter symbol ddr2-667 ddr2-800 unit note min max min max dq output access time from ck/ck tac -450 +450 -400 +400 ps dqs output access time from ck/ck tdqsck -400 +400 -350 +350 ps ck high-level width tch 0.45 0.55 0.45 0.55 tck ck low-level width tcl 0.45 0.55 0.45 0.55 tck ck half period thp min(tcl, tch) - min(tcl, tch) - ps 11,12 clock cycle time, cl=x tck 3000 8000 2500 ps 15 dq and dm input setup time tds(base) 100 - 50 - ps 6,7,8,2 0 dq and dm input hold time tdh (base) 175 - 125 - ps 6,7,8,2 1 control & address input pulse width for each input tipw 0.6 - 0.6 - tck dq and dm input pulse width for each input tdipw 0.35 - 0.35 - tck data-out high-impedance time from ck/ ck thz - tac max - tac max ps 18 dqs low-impedance time from ck/ck tlz(dqs) tac min tac max tac min tac max ps 18 dq low-impedance time from ck/ck tlz(dq) 2*tac min tac max 2*tac min tac max ps 18 dqs-dq skew for dqs and associated dq signals tdqsq - 240 -200 ps 13 dq hold skew factor tqhs - 340 -300 ps 12 dq/dqs output hold time from dqs tqh thp - tqhs - thp - tqhs - ps first dqs latching transition to associated clock edge tdqss - 0.25 + 0.25 - 0.25 + 0.25 tck dqs input high pulse width tdqsh 0.35 - 0.35 - tck dqs input low pulse width tdqsl 0.35 - 0.35 - tck dqs falling edge to ck setup time tdss 0.2 - 0.2 - tck dqs falling edge hold time from ck tdsh 0.2 - 0.2 - tck mode register set command cycle time tmrd 2 - 2 - tck write postamble twpst 0.4 0.6 0.4 0.6 tck 10 write preamble twpre 0.35 - 0.35 - tck address and control input setup time tis(base) 200 - 175 - ps 5,7,9,2 2 address and control input hold time tih(base) 275 - 250 - ps 5,7,9,2 3 read preamble trpre 0.9 1.1 0.9 1.1 tck 19 read postamble trpst 0.4 0.6 0.4 0.6 tck 19 activate to precharge command tras 45 70000 45 70000 ns 3 active to active command period for 1kb page size products trrd 7.5 -7.5 - ns 4 active to active command period for 2kb page size products trrd 10 -10 - ns 4
rev. 0.3 /mar. 2009 23 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) parameter symbol ddr2-667 ddr2-800 unit note min max min max four active window for 1kb page size products tfaw 37.5 - 37.5 - ns four active window for 2kb page size products tfaw 50 - 50 - ns cas to cas command delay tccd 2 2 tck write recovery time twr 15 -15 - ns auto precharge write recovery + precharge time tdal wr+trp - wr+trp - tck 14 internal write to read command delay twtr 7.5 -7.5 - ns internal read to precharge command delay trtp 7.5 7.5 ns 3 exit self refresh to a non-read command txsnr trfc + 10 trfc + 10 ns exit self refresh to a read command txsrd 200 - 200 - tck exit precharge power down to any non- read command txp 2 - 2 - tck exit active power down to read command txard 2 2 tck 1 exit active power down to read command (slow exit, lower power) txards 7 - al 8 - al tck 1, 2 cke minimum pulse width (high and low pulse width) t cke 3 3 tck odt turn-on delay t aond 2222tck odt turn-on t aon tac (min) tac (max) +0.7 tac (min) tac (max) +0.7 ns 6,16 odt turn-on (power-down mode) t aonpd tac(min)+2 2tck+ tac(max)+1 tac (min) +2 2tck+ tac(max)+1 ns odt turn-off delay t aofd 2.5 2.5 2.5 2.5 tck odt turn-off t aof tac (min) tac (max)+ 0.6 tac (min) tac (max) +0.6 ns 17 odt turn-off (power-down mode) t aofpd tac (min) +2 2.5tck+ tac(max)+1 tac (min) +2 2.5tck+ tac(max)+1 ns odt to power down entry latency tanpd 3 3 tck odt power down exit latency taxpd 8 8 tck ocd drive mode output delay toit 0 12 0 12 ns minimum time clocks remains on after cke asynchronously drops low tdelay tis + tck + tih tis + tck + tih ns 15 -continue-
rev. 0.3 /mar. 2009 24 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) general notes, which may apply for all ac parameters 1. slew rate measurement levels a. output slew rate for falling and rising edges is meas ured between vtt - 250 mv and vtt + 250 mv for single ended signals. for differential signals (e.g. dqs - dqs ) output slew rate is measured between dqs - dqs = -500 mv and dqs - dqs = +500mv. output slew rate is guaranteed by design, but is not necessarily tested on each device. b. input slew rate for single ended signals is measured fr om dc-level to ac-level: from vil (dc) to vih (ac) for rising edges and from vih (dc) and vil (ac) for falling edges. for differential signals (e.g. ck - ck ) slew rate for rising edges is measured from ck - ck = -250 mv to ck - ck = +500 mv(250mv to -500 mv for falling edges). c. vid is the magnitude of the di fference between the input voltage on ck and the input voltage on ck , or between dqs and dqs for differential strobe. 2. ddr2 sdram ac timing reference load the following figure represents the timing reference load used in defining the relevant timing parameters of the part. it is not intended to be either a prec ise representation of the typical system environment nor a depiction of the actual load presented by a production tester. system designers will use ibis or other simulation tools to correlate the timing reference load to a system environment. manufacturers will correlate to their pr oduction test conditions (generally a coaxial transmission line terminated at the tester electronics) . the output timing reference voltage level for single ended si gnals is the crosspoint with vtt. the output timing refer- ence voltage level for differential signals is the crosspoint of the true (e.g. dqs) and the complement (e.g. dqs) signal. 3. ddr2 sdram output slew rate test load output slew rate is characterized unde r the test conditions as shown below. 4. differential data strobe ddr2 sdram pin timings are specified for either single ende d mode or differential mode depending on the setting of the emrs ?enable dqs? mode bit; timing advantages of di fferential mode are realized in system design. the method by which the ddr2 sdram pin timings are me asured is mode dependent. in single vddq dut dq dqs dqs rdqs rdqs output v tt = v ddq /2 25 ? timing reference point ac timing reference load vddq dut dq dqs, dqs rdqs, rdqs output v tt = v ddq /2 25 ? test point slew rate test load
rev. 0.3 /mar. 2009 25 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) vref. in differential mode, these timing relationships are me asured relative to the crosspoint of dqs and its comple- ment, dqs . this distinction in timing methods is guaranteed by design and characterization. note that when differen- tial data strobe mode is disabled vi a the emrs, the complementary pin, dqs , must be tied externally to vss through a 20 ohm to 10 k ohm resistor to insure proper operation. 5. ac timings are for linear signal transitions. see system derating for other signal transitions. 6. these parameters guarantee device behavior, but they are not necessarily tested on each device. they may be guaranteed by device design or tester correlation. 7. all voltages referenced to vss. 8. tests for ac timing, idd, and electrical (ac and dc) characteristics, may be conducted at nominal reference/ supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. t ds t ds t dh t wpre t wpst t dqsh t dqsl dqs dqs d dmin dqs/ dq dm t dh figure -- data input (write) timing dmin dmin dmin d d d dqs v ih (ac) v il (ac) v ih (ac) v il (ac) v ih (dc) v il (dc) v ih (dc) v il (dc) t ch t cl ck ck ck/ck dqs/dqs dq dqs dqs t rpst q t rpre t dqsqmax t qh t qh t dqsqmax figure -- data output (read) timing q q q
rev. 0.3 /mar. 2009 26 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) specific notes for de dicated ac parameters 1. user can choose which active power down exit timing to use via mr s (bit 12). txard is expected to be used for fast active power down exit timing. txards is expected to be used for slow active power down exit timing where a lower power value is defined by each vendor data sheet. 2. al = additive latency 3. this is a minimum requirement. mini mum read to precharge timing is al + bl/2 providing the trtp and tras (min) have been satisfied. 4. a minimum of two clocks (2 * tck) is required irrespective of operating frequency 5. timings are guaranteed with command/a ddress input slew rate of 1.0 v/ns. see system derating for other slew rate values. 6. timings are guaranteed with data, mask, and (dqs/rdq s in singled ended mode) input slew rate of 1.0 v/ns. see system derating for other slew rate values. 7. timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. timings are guaranteed for dqs signals with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1v/ns in single ended mode. see system derating for other slew rate values. 8. tds and tdh derating table (for ddr2- 400 / 533) 1) for all input signals the total tds (s etup time) and tdh (hold time) required is calculated by adding the datasheet value to the derating value listed in above table. setup (tds) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vref (dc) and the first crossing of vih (ac) min. setup (tds) nominal slew rate for a falling sign al is defined as the slew rate between the last crossing of vref (dc) and the firs t crossing of vil (ac) max. if the actual signal is always earlier than the nominal slew rate line between shaded ? vref (dc) to ac region?, use nominal slew rate for derating value (see fig a.) if the actual signal is later than the nominal slew rate line anywhere between shaded ?v ref (dc) to ac region?, the slew rate of a tangent line to the actual sign al from the ac level to dc level is used for derating value (see fig b.) hold (tdh) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vil (dc) max and the first crossing of vref (dc). hold (tdh) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of vih (dc) min and the first crossing of vref (dc). if the actual sign al is earlier than the nominal slew rate line anywhere between shaded ?dc to vref (dc) region?, the slew rate of a tangent line to th e actual signal from the dc level to vref (dc) level is used for derating value (see fig d.) | td s | td h | td s | td h | td s | td h | td s | td h | td s | td h | td s | td h | td s | td h | td s | td h | td s | td h 2.0 1254512545+125+45------------ 1.5 83 21 83 21 +83 +21 95 33 - - - - - - - - - - 1.0 00000012122424-------- 0.9 - - -11 -14 -11 -14 1 -2 13 10 25 22 - - - - - - 0.8 - - - - -25 -31 -13 -19 -1 -7 11 5 23 17 - - - - 0.7 -------31-42-42-19-7-85-6176-- 0.6 - - - - - - - - -43 -59 -31 -47 -19 -35 -7 -23 5 -11 0.5 -----------74-89-62-77-50-65-38-53 0.4 -------------127-140-115-128-103-116 tds, tdh derating values(all units in 'ps', note 1 applies to entire table) 1.6 v/ns 1.4 v/ns 1.2 v/ns 1.0 v/ns 4.0 v/ns 3.0 v/ns 0.8 v/ns dq slew rate v/ns dqs, dqs differential slew rate 2.0 v/ns 1.8 v/ns
rev. 0.3 /mar. 2009 27 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) although for slow slew rates the total se tup time might be negative(i.e. a valid input signal will not have reached vih/ il (ac) at the time of the rising clock tr ansition) a valid input signal is still requ ired to complete the transition and reach vih/il (ac). for slew rate in between the values listed in table x, the derating valu ed may obtained by linear interpolation. these values are typically not subject to production test. they are verifi ed by design and characterization. hold (tdh) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vil (dc) max and the first crossing of vref (dc). hold (tdh) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of vih (dc) min and the first crossing of vref (dc). if the actual sign al is earlier than the nominal slew rate line anywhere between shaded ?dc to vref (dc) region?, the slew rate of a tangent line to th e actual signal from the dc level to vref (dc) level is used for derating value (see fig d.) although for slow slew rates the total se tup time might be negative(i.e. a valid input signal will not have reached vih/ il (ac) at the time of the rising clock tr ansition) a valid input signal is still requ ired to complete the transition and reach vih/il (ac). for slew rate in between the values listed in table x, the derating valu ed may obtained by linear interpolation. these values are typically not subject to production test. they are verifi ed by design and characterization.
rev. 0.3 /mar. 2009 28 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) fig. a illustration of nomi nal slew rate for tis, tds ck,dqs v ddq v ih (ac)min v ih (dc)min v ref (dc) v il (dc)max v il (ac)max vss delta tf delta tr v ref to ac region nominal slew rate nominal slew rate t is , t ds v ref (dc)-v il (ac)max setup slew rate falling signal = delta tf v ih (ac)min-v ref (dc) setup slew rate rising signal = delta tr t ih , t dh t is , t ds t ih , t dh ck, dqs
rev. 0.3 /mar. 2009 29 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) fig. -b illustration of tangent line for tis, tds ck, dqs v ddq v ih (ac)min v ih (dc)min v ref (dc) v il (dc)max v il (ac)max vss delta tf delta tr v ref to ac region tangent line tangent line t is , t ds ck, dqs nomial line nominal line delta tr tangent line[v ih (ac)min-v ref (dc)] setup slew rate rising signal = tangent line[v ref (dc)-v il (ac)max] setup slew rate falling signal = delta tf t ih , t dh t is , t ds t ih , t dh
rev. 0.3 /mar. 2009 30 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) fig. -c illustration of nominal line for tih, tdh ck, dqs v ddq v ih (ac)min v ih (dc)min v ref (dc) v il (dc)max v il (ac)max vss delta tr nominal slew rate nominal slew rate t is , t ds v ref (dc)-v il (dc)max hold slew rate rising signal = delta tr v ih (dc)min - v ref (dc) hold slew rate falling signal = delta tf dc to v ref region delta tf ck, dqs t ih , t dh t is , t ds t ih , t dh
rev. 0.3 /mar. 2009 31 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) fig. -d illustration of tangent line for tih, tdh ck, dqs v ddq v ih (ac)min v ih (dc)min v ref (dc) v il (dc)max v il (ac)max vss delta tf tangent line tangent line t is , t ds ck, dqs nominal line dc to v ref region nominal line delta tr tangent line[v ih (ac)min-v ref (dc)] hold slew rate falling signal = delta tf tangent line[v ref (dc)-v il (ac)max] hold slew rate rising signal = delta tr t ih , t dh t is , t ds t ih , t dh
rev. 0.3 /mar. 2009 32 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 9. tis and tih (input setup and hold) derating | tis | tih | tis | tih | tis | tih 6ojut /puft 4.0 +187 +94 +217 +124 +247 +124 ps 1 3.5 +179 +89 +209 +119 +239 +149 ps 1 3.0 +167 +83 +197 +113 +227 +143 ps 1 2.5 +150 +75 +180 +105 +210 +135 ps 1 2.0 +125 +45 +155 +75 +185 +105 ps 1 1.5 +83 +21 +113 +51 +143 +81 ps 1 1.0 +0 0 +30 +30 +60 60 ps 1 0.9 -11 -14 +19 +16 +49 +46 ps 1 0.8 -25 -31 +5 -1 +35 +29 ps 1 0.7 -43 -54 -37 -53 -7 +6 ps 1 0.6 -67 -83 -37 -53 -7 -23 ps 1 0.5 -100 -125 -80 -95 -50 -65 ps 1 0.4 -150 -188 -145 -158 -115 -128 ps 1 0.3 -223 -292 -255 -262 -225 -232 ps 1 0.25 -250 -375 -320 -345 -290 -315 ps 1 0.2 -500 -500 -495 -470 -465 -440 ps 1 0.15 -750 -708 -770 -678 -740 -648 ps 1 0.1 -1250 -1125 -1420 -1095 -1065 tbd ps 1 | tis | tih | tis | tih | tis | tih 6ojut /puft 4.0 +150 +94 +180 +124 +210 +154 ps 1 3.5 +143 +89 +173 +119 +203 +149 ps 1 3.0 +133 +83 +163 +113 +193 +143 ps 1 2.5 +120 +75 +150 +105 +180 +135 ps 1 2.0 +100 +45 +130 +75 +160 +105 ps 1 1.5 +67 +21 +97 +51 +127 +81 ps 1 1.0 0 0 +30 +30 +60 60 ps 1 0.9 -5 -14 +25 +16 +55 +46 ps 1 0.8 -13 -31 +17 -1 +47 +29 ps 1 0.7 -22 -54 +8 -24 +38 +6 ps 1 0.6 -34 -83 -4 -53 -26 -23 ps 1 0.5 -60 -125 -30 -95 0 -65 ps 1 0.4 -100 -188 -70 -158 -40 -128 ps 1 0.3 -168 -292 -138 -262 -108 -232 ps 1 0.25 -200 -375 -170 -345 -140 -315 ps 1 0.2 -325 -500 -295 -470 -265 -440 ps 1 0.15 -517 -708 -487 -678 -457 -648 ps 1 0.1 -1000 -1125 -970 -1095 -940 -1065 ps 1 tis, tih derating values for ddr2 400, ddr2 533 command / address slew rate(v/ns) 2.0 v/ns ck, ck differential slew rate 1.5 v/ns 1.0 v/ns command / address slew rate(v/ns) tis, tih derating values for ddr2 667, ddr2 800 ck, ck differential slew rate 2.0 v/ns 1.5 v/ns 1.0 v/ns
rev. 0.3 /mar. 2009 33 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 1) for all input signals the total tis (setup time) and tih (h old) time) required is calcul ated by adding the datasheet value to the derating value listed in above table. setup (tis) nominal slew rate for a rising signal is de fined as the slew rate betw een the last crossing of v ref (dc) and the first crossing of v ih (ac) min. setup (tis) nominal slew rate for a fall ing signal is defined as the slew rate between the last crossing of v ref (dc) and the firs t crossing of v il (ac) max. if the actual signal is always earlier than the nominal slew rate for line between shaded ?v ref (dc) to ac region?, use nominal slew rate for derating value (see fig a.) if the actual signal is later than the nominal sl ew rate line anywhere between shaded ?v ref (dc) to ac region?, the slew rate of a tangent line to the actual signal from the ac level to dc level is used for derating value (see fig b.) hold (tih) nominal slew rate for a rising signal is defined as the slew rate between the la st crossing of vil (dc) max and the first crossing of v ref (dc). hold (tih) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of v ref (dc). if the actual signal is always later than the nominal slew rate line between shaded ?dc to v ref (dc) region?, use nominal slew rate for derating value (see fig.c) if the actual signal is earlier than the nominal slew rate line anywhere between shaded ?dc to v ref (dc) region?, the slew rate of a tangent line to the actual signal from the dc level to v ref (dc) level is used for derating value (see fig d.) although for slow rates the total setup time might be ne gative(i.e. a valid input sign al will not have reached v ih/il (ac) at the time of the rising clock transiti on) a valid input signal is still required to complete the transition and reach v ih/ il (ac). for slew rates in between the values listed in table, th e derating values may obtained by linear interpolation. these values are typically not subject to production test. they are verifi ed by design and characterization. 10. the maximum limit for this parameter is not a device limi t. the device will operate with a greater value for this parameter, but system performance (bus turnaround) will degrade accordingly. 11. min (t cl, t ch) refers to the smaller of the actual clock low time and the actual clock hi gh time as provided to the device (i.e. this value can be greater than the minimu m specification limits for t cl and t ch). for example, t cl and t ch are = 50% of the period, less the half period jitter (t jit(hp)) of the clock source, and less the half period jitter due to crosstalk (tjit (crosstalk)) into the clock traces. 12. t qh = t hp ? t qhs, where: thp = minimum half clock pe riod for any given cycle and is defined by clock high or clock low (tch, tcl). tqhs accounts for: 1) the pulse duration distortion of on-chip clock circuits; and 2) the worst case push-out of dqs on one transition foll owed by the worst case pull-i n of dq on the next transi- tion, both of which are, separately, due to data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers. 13. tdqsq: consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as output slew rate mismatch between dqs/ dqs and associated dq in any given cycle. 14. dal = wr + ru {trp (ns)/tck (ns)}, where ru stands for round up. wr refers to the twr parameter stored in the mrs. for trp, if the result of the division is not already an integer, round up to the next hi ghest integer. tck refers to the application clock period. example: for ddr533 at tck = 3.75ns with twr programmed to 4 clocks.
rev. 0.3 /mar. 2009 34 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) tdal = 4 + (15ns/3.75ns) clocks = 4+(4) clocks = 8 clocks. 15. the clock frequency is allowed to change during self?r efresh mode or precharge power-down mode. in case of clock frequency change during precharge power-down, a sp ecific procedure is required as described in section 2.9. 16. odt turn on time min is when the device leaves high impedance and odt resistance begins to turn on. odt turn on time max is when the odt resistance is fully on. both are measured from taond.
rev. 0.3 /mar. 2009 35 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 17. odt turn off time min is when the de vice starts to turn off odt resistance. odt turn off time max is when the bus is in high impedance. both are measured from taofd. 18. thz and tlz transitions occur in the same access time as valid data transiti ons. thesed parameters are referenced to a specific voltage level which sp ecifies when the device output is no longer driving (thz), or begins driving (tlz). below figure shows a method to ca lculate the point when device is no longer driving (thz), or begins driving (tlz) by measuring the signal at two different voltages. the actual voltage measurement points are not critical as long as the calculation is consistent. 19. trpst end point and trpre begin point are not referenced to a specific voltage level but specify when the device output is no longer driving (trpst), or begins dr iving (trpre). below figure show s a method to calculate these points when the device is no longer driving (trpst), or begins driving (trpre). below figure shows a method to calculate these points when the device is no longer driving (trpst), or begins driving (trpre) by measuring the signal at two different voltages. the actual voltage meas urement points are not critical as long as the calculation is consistent. 20. input waveform timing with differential data strobe enabled mr[bit10] =0, is referenced from the input signal crossing at the v ih (ac) level to the differential data strobe crosspoi nt for a rising signal, and from the input signal crossing at the v il (ac) level to the differential data strobe crosspoi nt for a falling signal applied to the device under test. 21. input waveform timing with differential data strobe enabled mr[bit10]=0, is referenced from the input signal crossing at the v ih (dc) level to the differential data stro be crosspoint for a rising signal and v il (dc) to the differential data strobe crosspoint for a falling signal applied to the device under test. 22. input waveform timing is referenced from the input signal crossing at the v ih (ac) level for a rising signal and v il (ac) for a falling signal applied to the device under test. 23. input waveform timing is referenced from the input signal crossing at the v il (dc) level for a rising signal and v ih (dc) for a falling signal applied to the device under test. 22. input waveform timing is referenced from the input signal crossing at the v ih (ac) level for a rising sig- nal and v il (ac) for a falling signal app lied to the device under test. 23. input waveform timing is referenced from the input signal crossing at the v il (dc) level for a rising sig- nal and v ih (dc) for a falling signal appl ied to the device under test. thz , trpst end point = 2*t1-t2 tlz , trpre begin point = 2*t1-t2 voh + xmv voh + 2xmv vol + 1xmv vol + 2xmv thz trpst end point vtt + 2xmv vtt + xmv vtt -xmv vtt - 2xmv thz trpre begin point dqs v ddq v ih(ac) min v ih(dc) min tdh tds dqs v ref (dc) v ss v il(dc) max v il(ac) max tdh tds differential input waveform timing
rev. 0.3 /mar. 2009 36 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 22. input waveform timing is referenced from the input signal crossing at the v ih (ac) level for a rising signal and v il (ac) for a falling signal applied to the device under test. 23. input waveform timing is referenced from the input signal crossing at the v il (dc) level for a rising signal and v ih (dc) for a falling signal applied to the device under test. 24. twtr is at least two clocks (2*t ck) independent of operation frequency. 25. input waveform timing with single-ended data strobe en abled mr[bit10] = 1, is referenced from the input signal crossing at the vih (ac) level to the single-ended data strobe crossing vih/l (dc) at the start of its transition for a rising signal, and from the input signal crossing at the vil (ac) level to the single-ended data strobe crossing vih/l (dc) at the start of its transition for a falling signal applied to the device under test. the dqs signal must be monotonic between vil (dc) max and vih (dc) min. 26. input waveform timing with single-ended data strobe en abled mr[bit10] = 1, is referenced from the input signal crossing at the vih (dc) level to the single-ended data strobe crossing vi h/l(ac) at the end of its transition for a rising signal, and from the input signal crossing at the vil (dc) level to the single-ended data strobe crossing vih/l(ac) at the end of its transition for a falling si gnal applied to the device under test. the dqs signal must be monotonic between vil (dc) max and vih (dc) min. 27. tcke min of 3 clocks means cke must be registered on three consecutive positive cloc k edges. cke must remain at the valid input level the entire time it takes to achi eve the 3 clocks of registration. thus, after any cke transition, cke may not transition from its valid level during the time period of tis + 2*tck + tih. 28. if tds or tdh is violated, data corr uption may occur and the data must be re -written with valid data before a valid read can be executed. 29. these parameters are measured from a command/address si gnal (cke, cs, ras, cas, we, odt, ba0, a0, a1, etc.) transition edge to its respective clock signal (ck/ ck) crossing. the spec values are not affected by the amount of clock jitter applied (i.e. tjit (per), tjit (cc), etc.), as the setup and hold are relative to the clock signal crossing that latches the command/address. that is, these para meters should be met whether clock jitter is present or not. 30. these parameters are measured from a data strobe sign al ((l/u/r)dqs/dqs) crossing to its respective clock signal (ck/ck) crossing. the spec values are not affected by the amount of clock jitter applied (i.e. tjit (per), tjit (cc), etc.), as these are relative to the clock signal crossing. that is, these parameters should be met whether clock jitter is present or not. 31. these parameters are measured from a data signal ((l/u) dm, (l/u) dq0, (l/u) dq1, etc.) transition edge to its respective data strobe signal ((l/u/r)dqs/dqs) crossing. 32. for these parameters, the ddr2 sdram devi ce is characterized and verified to support tnparam = ru {tparam / tck (avg)}, which is in clock cy cles, assuming all input clock jitter specifications are satisfied. for example, the device will su pport tnrp = ru {trp / tck (avg)}, which is in clock cycles, if all input clock jitter spec- ifications are met. this means: for ddr2-667 5-5-5, of which trp = 15ns, the device will support tnrp =ru {trp / tck (avg)} = 5, i.e. as long as the input clock jitter specifications are met, precharge command at tm and active command at tm+5 is valid even if (tm+5 - tm) is less than 15ns due to input clock jitter. 33. tdal [nck] = wr [nck] + tnrp [nck] = wr + ru {t rp [ps] / tck (avg) [ps]}, where wr is the value
rev. 0.3 /mar. 2009 37 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 33. tdal [nck] = wr [nck] + tnrp [nck] = wr + ru {trp [ps] / tck (avg) [ps]}, where wr is the value programmed in the mode register set. 34. new units, ?tck (avg)? and ?nck?, are introduced in ddr2-667 and ddr2-800. unit ?tck (avg)? represents the actual tc k (avg) of the input clock under operation. unit ?nck?, represents one clock cycle of the input clock, counting the actual clock edges. note that in ddr2-400 and ddr2-533, ?tck?, is used for both concepts. ex) txp = 2 [nck] means; if power down exit is registered at tm, an active command may be registered at tm+2, even if (tm+2 - tm) is 2 x tck (avg) + terr(2per),min. 35. input clock jitter spec parameter. these parameters and th e ones in the table below are referred to as 'input clock jitter spec parameters' and these parameters apply to ddr2-667 and ddr2-800 only. the jitter specified is a random jitter meeting a gaussian distribution. parameter symbol ddr2-667 ddr2-800 units notes min max min max clock period jitter tjit (per) -125 125 -100 100 ps 35 clock period jitter during dll locking period tjit (per, lck) -100 100 -80 80 ps 35 cycle to cycle clock period jitter tjit (cc) -250 250 -200 200 ps 35 cycle to cycle clock period jitter during dll locking period tjit (cc, lck) -200 200 -160 160 ps 35 cumulative error across 2 cycles terr(2per) -175 175 -150 150 ps 35 cumulative error across 3 cycles terr(3per) -225 225 -175 175 ps 35 cumulative error across 4 cycles terr(4per) -250 250 -200 200 ps 35 cumulative error across 5 cycles terr(5per) -250 250 -200 200 ps 35 cumulative error across n cycles, n=6...10, inclusive terr(6~10per) -350 350 -300 300 ps 35 cumulative error across n cycles, n=11...50, inclusive terr(11~50per) -450 450 -450 450 ps 35 duty cycle jitter tjit (duty) -125 125 -100 100 ps 35
rev. 0.3 /mar. 2009 38 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 36. these parameters are specified per their average values, however it is understood that the following relationship between the average timing and the absolute instantaneous timing holds at all times. (min and max of spec values are to be used for calculations in the table below.) example: for ddr2-667, tch (abs), min = (0.48 x 3000 ps) - 125 ps = 1315 ps 37. thp is the minimum of the absolute half period of the actual input clock. thp is an input parameter but not an input specification parameter. it is used in co njunction with tqhs to derive the dram output timing tqh. the value to be used for tqh calculation is determined by the following equation; thp = min (tch (abs), tcl (abs)), where, tch (abs) is the minimum of the actu al instantaneous clock high time; tcl (abs) is the minimum of the actual instantaneous clock low time; 38. tqhs accounts for: 1) the pulse duration distortion of on-chip clock circ uits, which represents how we ll the actual thp at the input is transferred to the output; and 2) the worst case push-out of dqs on one transition fo llowed by the worst case pull-in of dq on the next transition, both of which are independent of each othe r, due to data pin skew, output pattern effects, and p-channel to n-channel variation of the output drivers 39. tqh = thp? tqhs, where: thp is the minimum of the absolute half period of the actual input clock; and tqhs is the specification value under the max column. {the less half-pulse width distortion present, the larger the tqh value is; and the larger the valid data eye will be.} examples: 1) if the system provides thp of 1315 ps into a ddr2-667 sdram, the dram provides tqh of 975 ps min- imum. 2) if the system provides thp of 1420 ps into a ddr2-667 sdram, the dram provides tqh of 1080 ps minimum. 40. when the device is operated with input clock jitter, this parameter needs to be derated by the actual terr(6-10per) of the input clock. (output deratings are relative to the sdram input clock.) for example, if the measured jitter into a ddr2-667 sdram has terr(6-10per),min = - 272 ps and terr(6-10per), max = + 293 ps, then tdqsck, min (derated) = tdqsck, min - terr(6-10per),max = - 400 ps - 293 ps = - 693 ps and tdqsck, max (derat ed) = tdqsck, max - terr(6-10per),min = 400 ps + parameter symbol min max units absolute clock period tck (abs) tck (avg), min + tjit (per), min tck (avg), max + tjit (per), max ps absolute clock high pulse width tch (abs) tch (avg), min* tck (avg), min + tjit (per), min tch (avg), max* tck (avg), max + tjit (per), max ps absolute clock low pulse width tcl (abs) tcl (avg), min* tck (avg), min + tjit (per), min tcl (avg), max* tck (avg), max + tjit (per), max ps
rev. 0.3 /mar. 2009 39 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) = + 672 ps. similarly, tlz (dq) for ddr2-667 derates to tlz (dq), min (derated) = - 900 ps - 293 ps = - 1193 ps and tlz (dq), max (derated) = 450 ps + 272 ps = + 722 ps. (caution on the min/max usage!) 41. when the device is operated with input clock jitter, this parameter needs to be derated by the actual tjit (per) of the input clock. (output derati ngs are relative to the sdram input clock.) for example, if the measured jitter into a ddr2-667 sdram has tjit (per), min = - 72 ps and tjit (per), max = + 93 ps, then trpre, min (derated) = trpre, mi n + tjit (per), min = 0.9 x tck (avg) - 72 ps = + 2178 ps and trpre, max (derated) = trpre, max + tjit (per), max = 1.1 x tck (avg) + 93 ps = + 2843 ps. (caution on the min/max usage!) 42. when the device is operated with input clock jitter, this parameter needs to be derated by the actual tjit (duty) of the input clock. (output deratings are relative to the sdram input clock.) for example, if the measured jitter into a ddr2-667 sd ram has tjit (duty), min = - 72 ps and tjit (duty), max = + 93 ps, then trpst, min (derated) = trpst, min + tjit (duty), min = 0.4 x tck (avg) - 72 ps = + 928 ps and trpst, max (derated) = trpst, max + tjit (duty), max = 0.6 x tck (avg) + 93 ps = + 1592 ps. (caution on the min/max usage!) 43. when the device is operated with input clock jitter, this parameter needs to be derated by {- tjit (duty), max - terr(6-10per),max} and {- tjit (d uty), min - terr(6-10per),min} of the actual input clock.(output deratings are relative to the sdram input clock.) for example, if the measured jitter into a ddr 2-667 sdram has terr(6-10per),min = - 272 ps, terr(6- 10per), max = + 293 ps, tjit (duty), min = - 106 ps and tjit (duty), max = + 94 ps, then taof, min (der- ated) = taof, min + {- tjit (duty), max - terr(6- 10per),max} = - 450 ps + {- 94 ps - 293 ps} = - 837 ps and taof, max (derated) = taof, max + {- tjit (duty) , min - terr(6-10per),min} = 1050 ps + {106 ps + 272 ps} = + 1428 ps. (caution on the min/max usage!) 44. for taofd of ddr2-400/533, the 1/2 clock of tck in the 2.5 x tck assumes a tch, input clock high pulse width of 0.5 relative to tck. taof, min and ta of, max should each be de rated by the same amount as the actual amount of tch offset present at the dram input with respect to 0.5. for example, if an input clock has a worst case tch of 0.45, the taof, min sh ould be derated by subtracting 0.05 x tck from it, whereas if an input clock has a worst case tch of 0. 55, the taof, max should be derated by adding 0.05 x tck to it. therefore, we have; taof, min (derated) = tac, min - [0 .5 - min(0.5, tch, min)] x tck taof, max (derated) = tac, max + 0.6 + [max(0.5, tch, max) - 0.5] x tck or taof, min (derated) = min (tac, min, tac, min - [0.5 - tch, min] x tck) taof, max (derated) = 0.6 + max (tac, max, tac, max + [tch, max - 0.5] x tck) where tch, min and tch, max are the minimum and maximum of tch actually measured at the dram input balls. 45. for taofd of ddr2-667/800, the 1/2 clock of nck in the 2.5 x nck assumes a tch (avg), average input clock high pulse width of 0.5 relative to tck (avg). taof, min and taof, max should each be derated by the same amount as the actual amount of tch (avg) of fset present at the dram input with respect to 0.5. for example, if an input clock has a worst case tch (a vg) of 0.48, the taof, min should be derated by sub- tracting 0.02 x tck (avg) from it, whereas if an inpu t clock has a worst case tch (avg) of 0.52, the taof, max
rev. 0.3 /mar. 2009 40 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) should be derated by adding 0.02 x tck (avg) to it. therefore, we have; taof, min (derated) = tac, min - [0.5 - min(0.5, tch (avg), min)] x tck (avg) taof, max (derated) = tac, max + 0.6 + [max (0.5, tch (avg), max) - 0.5] x tck (avg) or taof, min (derated) = min (tac, min, tac, min - [0.5 - tch (avg), min] x tck (avg)) taof, max (derated) = 0.6 + max (tac, max, tac, max + [tch (avg), max - 0.5] x tck (avg)) where tch (avg), min and tch (avg), max are the minimu m and maximum of tch (avg) actually measured at the dram input balls. note that these deratings are in addition to the taof derati ng per input clock jitter, i.e. tjit (duty) and terr(6-10per). however tac values used in the equations shown above ar e from the timing parameter table and are not derated. thus the final derated values for taof are; taof, min (derated_final) = taof, min (derated ) + {- tjit (duty), max - terr(6-10per),max} taof, max (derated_final) = taof, max (derated ) + {- tjit (duty), min - terr(6-10per),min}
rev. 0.3 /mar. 2009 41 1 h5ps5142ffp-xx(c/l) h5ps5182ffp-xx(c/l) 5. package dimensions package dimension(x4,x8) 60ball fine pitch ball grid array outline a1 ball mar k 10.00 +/- 0.10 10.50 +/- 0.10 0.8 x 10 = 8.0 a b c d e f g h j k l 1 2 3 7 8 9 0.34 +/- 0.05 1.20 max. 0.80 0.80 0.80 x 8 = 6.40 a1 ball mark note: all dimension units are millimeters. 60 - 0.45 ? 0.05

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